We have already seen a few bits and bobs concerning the Honor 8X Max and now we have a new leak which reveals the device’s key specifications.
The handset is listed on TENAA alongside all the other hardware specs and renders but that specific listing does not mention the make of the OSC chip that powers the phone.
The current leak comes from Weibo and indicated that the Honor 8X Max with the model number ARE-AL00 – model number which matches the TENAA report last week – is powered up by a Qualcomm Snapdragon 660 processor. It has Adreno 502 GPU and 4GB of RAM.
According to the leak the phone has a display with Full HD+ resolution (2244 x 1080 pixels) and brings along a dual camera module with a 16MP primary sensor and 2MP secondary sensor. At the front, it features an 8MP camera.
Other features include 4G VoLTE, WI-Fi, Bluetooth, GPS and a 3.5mm headphone jack. The phone also features onboard sensors that include an ambient light sensor, proximity sensor and fingerprint sensor. All of it is backed up by a 4,900mAh battery and the phone altogether weighs 210 grams.
The release date for the device is not very far so I’m sure we will hear more about the specs pretty soon.
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