Leica Camera AG and PMD Technologies have have unveiled their Time-of-Flight reference design for mobile applications during the Mobile World Congress.
This reference design has been dubbed Holkin and is, according to the companies, the smallest 3D camera capable of high resolution, when compared to other cameras of its kind currently available on the market.
The Holkin uses, of course, a Leica lens, optimized for 940nm, which was designed for PMD’s newly announced 3D imager IRS2771C. The module has a z-height of 4.2mm and a resolution of HVGA (480 x 320).
The module can be used as a selfie camera or a rear sensor and can also deliver on features like face unlock and augmented reality.
Based on the close partnership with Leica, we can leverage our optics know-how for best-in-class 3D depth sensing systems. We share a common passion for great engineering work – be it on optics, signal processing software, module or ASIC level
Dr. Bernd Buxbaum, CEO of PMD Technologies
For the time being, neither Leica or PMD Technologies have announced any mobile partners that will be or are interested in using the ToF units the two companies have developed.
Even so, it’s well-known that Huawei and Leica have been collaborating closely so the new sensor might feature on a Huawei handset pretty soon.