The new PlayStation 5 Devkit patent news needs to be taken with a grain of salt. Even if The World Intellectual Property Organization (WIPO) is a reputable source and is one of the 15 specialized agencies of the United Nations, and the applicant is SONY INTERACTIVE ENTERTAINMENT INC.
The PlayStation 5 devkit patent includes schematics and detailed specs for the PS5. The ‘electronic device (PS5) proposed in the patent includes an exterior member, a cooling target component arranged inside the exterior member, and a plurality of cooling fans arranged inside the exterior member’.
In essence, Sony patented with the WIPO the cooling system of the PS5 devkit, and this raised some concerns that the final PlayStation 5 hasn’t taken care of heating and airflow issues. In the industry, this is called a utility patent file.
The concerning factor, if the patent is to be believed, is how will the PS5 going to cool down the AMD Zen 2 CPU and RDNA 2 GPU? Is that ‘plurality of cooling fans’ powerful enough to help the heat sink deal with so much hot air? The PS5 has an 8-core Zen 2 CPU and 10.28 TFLOP-capable RDNA 2 GPU. Those kinds of specs generate a lot of heat. And the patent proposed by Sony for the console doesn’t look like an efficient cooling solution for keeping the PS5’s heating under control.
In the patent, there is also no mention of the PlayStation brand or any of the regularly associated trademarks. This can very well be a patent for a future DEVkit that PlayStation intends to use. The size and design of it suggest that. There is also the fact that Sony requested the patent to be kept confidential until a certain date.
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