Chip manufacturer HiSilicon will add 5G modems to all the Kirin 985 processors, making future Huawei flagships 5G-ready.
The FC-PoP method (FlipChip Package-on-Package) will be used to manufacture the processors. This will allow vertical stacking of transistors. Along with the Extreme UltraViolet process, the transistor density will raise up to 20% creating a great formula: better chip performance + lower energy consumption.
The development of the new chips is scheduled for the third quarter of 2019, especially considering Huawei will probably launch its new Mate series this October.
Huawei could be trying to compete with Apple’s A13 processor and therefore, wants to invest more in creating an integrated fan-out package (InFO) that will allow a higher number of contacts, without changing the die size.