Phones

Next Kirin 985 Chipset Batch Will Offer 5G

huawei kirin 970

Chip manufacturer HiSilicon will add 5G modems to all the Kirin 985 processors, making future Huawei flagships 5G-ready.

The FC-PoP method (FlipChip Package-on-Package) will be used to manufacture the processors. This will allow vertical stacking of transistors. Along with the Extreme UltraViolet process, the transistor density will raise up to 20% creating a great formula: better chip performance + lower energy consumption.

The development of the new chips is scheduled for the third quarter of 2019, especially considering Huawei will probably launch its new Mate series this October.

Huawei could be trying to compete with Apple’s A13 processor and therefore, wants to invest more in creating an integrated fan-out package (InFO) that will allow a higher number of contacts, without changing the die size.


Follow TechTheLead on Google News to get the news first.

Subscribe to our website and stay in touch with the latest news in technology.

Must Read

Are you looking for the latest innovations in tech? You're in the right place, just subscribe to our RSS feed


Techthelead Romania     Comedy Store

Copyright © 2016 - 2023 - TechTheLead.com SRL

To Top