Qualcomm spilled the beans yesterday on its new flagship chipset, the Snapdragon 855, by posting the website page ahead of the conference.
While the details revealed yesterday left little to the imagination, now we have the full, official Snapdragon 855 specs sheet and boy, are they something!
The new chipset comes with a new vision processor that can capture 4K HDR at 60 fps with 25% less power consumption than the Snapdragon 845. The new 7nm process (as compared to Snapdragon 845’s 10nm), will also improve power consumption.
The Snapdragon 845 octa-core processor has Qualcomm’s 4th generation multi-core AI engine. For those not keeping up with the nuts and bolts of chipsets, what this means is that the Snapdragon 855 will have 3x the performance boost for AI over the Snapdragon 845.
Of course, what really seals the deal is the fact that Snapdragon 855 will be the first to support 5G, which means that most smartphone makers will probably include it in their flagships to get ready for the 2019-2020 rollout.
A bit overshadowed by the new chipset, Qualcomm’s other announcement is the 3D Sonic Sensor, the “world’s first commercial ultrasonic fingerprint solution supported under the display.”
While other solutions still get their detection tripped by dust or moisture, Qualcomm says that the new 3D Sonic Sensor has no such qualms.
That means you should expect next year’s flagships to ship with both 5G capabilities and in-display fingerprint readers.
The first flagship 5G smartphone in 2019 will of course be one from Samsung’s lineup, as previously reported.
Also read: ✍Apple vs. Qualcomm: Companies To Sever All Ties✍
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